Busnaina to Serve as Lunch Keynote at CMSE 2026
University Distinguished and MIE William Lincoln Smith Professor Ahmed Busnaina will discuss “High-throughput Additive Manufacturing of Microelectronics including Passive and Active Components for 3D HI, Legacy Electronics and Advanced Packaging” as the Lunch & Learn Keynote Speaker at the 29th Annual Components for Military & Space Electronics Conference & Exhibition. He will present on April 29, 2026, in Los Angeles.